What you get:
The round-wafer-versus-panel math that caps CoWoS-L's size and frees EMIB, worked out in full.
Why warpage and CTE mismatch push both TSMC and Intel onto glass by the end of the decade.
The OSATs that win whichever foundry takes the volume, and the June 2026 deals that lock it in.
The Taiwanese name already inside TSMC's CoPoS glass program that the investment maps leave out.